HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem

On November 22, as part of the 10th Anniversary of the Vietnam Invention Association, Ho Chi Minh City University of Technology (HUTECH) signed a Memorandum of Understanding with the Vietnam Invention Association (the VIA). This marks an important milestone in the university’s strategy to strengthen its intellectual property ecosystem, technology transfer activities, and innovation initiatives.
 
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 10
The signing ceremony took place during the 10th Anniversary of the Vietnam Invention Association
 
Under the MoU, HUTECH and the VIA will jointly implement a range of activities to enhance intellectual property management and strengthen the university’s research capacity. Key areas of cooperation include:
 
- Legal consultation and technical support in intellectual property, along with the development of processes and policies suited to HUTECH’s research and training environment.
- Organizing training programs, workshops, and seminars to help students, faculty, and researchers deepen their understanding of patent protection, utilization, and practical applications.
- Supporting patent analysis and searches to facilitate scientific research and technology development.
- Collaborating on communication initiatives to promote creativity and innovation within the broader community.

 
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 31 HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 34
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 37
HUTECH officially signs the MoU with the Vietnam Invention Association
 
Notably, the VIA will provide in-depth support to HUTECH in preparing and filing patent and utility solution applications. This partnership will help streamline the application process and improve the accuracy of technical descriptions and patent classifications, increasing the likelihood of successful registration.
 
At the event, HUTECH also formally joined VIA as an official member. This membership strengthens the university’s connection to a wide network of experts, inventors, and enterprises in the field of intellectual property. With this new position, HUTECH’s research and development activities are expected to accelerate, creating opportunities for faculty and students to bring their innovative ideas into practice through established protection and technology transfer mechanisms.

 
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 55 HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 57
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 58
HUTECH officially becomes a member of the Vietnam Invention Association

Joining the Association also provides HUTECH with additional resources to increase the number of patents, utility solutions, and other intellectual property assets in the coming years. This is a key component in the university’s strategy to enhance research capacity, advance technology transfer, and build a sustainable innovation ecosystem.
 
HUTECH signs MoU with Vietnam Invention Association to advance intellectual property and innovation ecosystem 71
Looking ahead, HUTECH and the Association will continue to expand collaboration across multiple fields
 
In the next phase, HUTECH and the VIA will develop annual action plans focused on training, consultation, intellectual property system development, and technical support for research projects. Long term cooperation programs will also be established to deliver practical value for students, faculty, and industry partners.

News: Department of Science and Technology
Communication Center
14630105
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